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Plate Heat Exchangers
   
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Schlenk
amongst others our products are
used for following applications:

Batteries

Beaten Metal / Metal Leaf

Silver for decorative products

Cable-Shielding

EMI-Shielding

Flexible Printed Circuits (FPC)

FFC / FFCL

Heating foils

Lamination

Plate Heat Exchangers

Special Printed Circuits

Solar

Transformers

Fuses







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Schlenk-Product:

-  OF-copper foil

-  Copper-nickel foil

-  Bronze foil




Used as brazing foil for brazed plate heat exchangers.

Mainly oxygenfree copper foil. For special heat exchangers for marine vessels or chemical plants also copper-nickel foils or bronze foils are requested.



Standard specification:

Base-material
-  Copper foil OF-Cu (BS: 110 ; CDA 101)
-  Copper-nickel foil (e.g. CuNi8, CuNi10, etc.)
-  Bronze foil (CuSn6)

Strip thickness:             0.010 - 0.150 mm (.0004" - .006")   
often used thicknesses:   0.050 mm / 0.060 mm (0.002" / 0.0024")
             
Width:                           1 mm - 650 mm (.04" - 25.6")
                                     (depending on strip thickness)

                                     copper-nickel and bronze sometimes only
                                     available up to width of approx. 300 mm (11.81")
                                     (depending on quantity and quality)

Format:                         available in coil or cut to sheets, not levelled




Coil sizes:

ID: 150 mm (6") plastic core

ID: 76 mm (3") steel core

Other cores-ID on request










Advantages of Schlenk‘s foil:

-  high purity coppers
-  special quality for brazed plate heat exchangers 
   (developped with key customers)
-  wider width than most competitiors


Lot sizes:

We supply small lots for R&D, quickly and with the utmos flexiblity as well as large lots up to complete container loads.


>> PDF (mm)                >> PDF (inch)


all information contained herein is believed to be reliable, but the accuracy and completeness thereof are not guaranteed. The user shall determine the suitability of the product for the intended application.

 
Last update: 08.10.2009
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